This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …

Dec 12, 2023 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …

Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …

Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had …

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as …

Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to …

Through this partnership, DISCO provides global services including R&D, test cuts, the sale of equipment, and after-sale support using Plasma-Therm plasma dicing equipment.

DISCO Technical Review Feb. 2016 Semiconductor and LED manufacturers who use SDEs not licensed by Hamamatsu Photonics and their products probably infringe these SD patents.

DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。