Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

Y.L. Wang, VP of fab operations at TSMC, will be elevated to senior VP for his efforts in resolving challenges at the foundry ...

Speaking at a National Taiwan University event, Wei outlined a series of obstacles that have slowed progress and increased costs for TSMC's U.S. expansion. These challenges ...

In fact, TSMC customers (e.g., NVIDIA, and AMD) are scaling their AI and HPC workloads, while demand for CoWoS packaging is so strong that TSMC accelerated its capacity expansion from 2026 to 2025.

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS ... to save their log-in information so they do not have ...

Due to London Stock Exchange licensing terms, we stipulate that you must be a private investor. We apologise for the inconvenience. To access our Live RNS you must confirm you are a private ...

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

In November, Commerce finalised a $6.6 billion grant to TSMC’s US unit for semiconductor production in Phoenix, Arizona. “For the first time ever in our country’s history, we are making ...

TSMC plans to invest a total of $65 billion (about 96 trillion won) in the U.S. and construct three factories by 2030. The second TSMC factory is ... to enhance personal information cooperation ...

According to undisclosed information cited by news site ... Apple outsources post-processing of semiconductors made at TSMC Arizona factory to Amkor and plans to build a new factory worth 300 ...

They note that the CoWoS (Chip on Wafer on Substrate) will remain a critical bottleneck for datacenter AI, and suppliers like TSMC, which are expected to ... that ensures the prompt conveyance of ...