In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most ...

Alphawave Semi announces successful tape out of UCIe IP subsystem on TSMC's 2-nm process, supporting 36G die-to-die data ...

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology ...

While dozens of companies have benefited from the evolution of AI ... TSM), which is also known as "TSMC." During the March-ended quarter, Druckenmiller purchased 491,265 shares of Taiwan Semi ...

which is an evolution of the NanoFlex standard cell architecture. TSMC continues to advance its Chip on Wafer on Substrate (CoWoS) technology to address AI’s insatiable need for more logic and ...

TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit. According to Tom’s Hardware, the outfit is working on a 9.5 ...

Large-size CoWoS, SOW-X, and more Meanwhile, TSMC is also advancing its Chip on Wafer on Substrate (CoWoS) technology to meet AI’s growing demand for logic and HBM. The foundry giant announced that by ...

The SoW-X technology builds on TSMC’s expertise in advanced packaging solutions, such as its Chip on Wafer on Substrate (CoWoS) and Integrated Fan-Out ... on Wafer-X marks a defining moment in the ...

What Happened: Market chatter suggested that Nvidia's CoWoS wafer orders at TSMC had been cut from over 400,000 wafers to 380,000 wafers, fueling concerns about AI demand fluctuations. However ...

The evolution of back-end packaging and test technologies ... for chip-on-wafer-on-substrate (CoWoS) integration, and InFO fan-out packaging technologies, TSMC currently dominates advanced packaging ...