The eco-friendly approach could transform the PCB industry by cutting costs, reducing waste, and powering the future of ...

Boise State University researchers have unveiled a cutting-edge approach to manufacturing flexible hybrid circuits—reducing ...

As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the ...

Flexible, conformal polyimide (PI) aerogels with low density, good mechanical properties, and high surface areas have attracted much attention for many potential applications such as lightweight ...

Circuposit™ SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced ...

The sensor is made by ink-jet printing of silver ink on polyimide substrate, in that manner providing a combination of electrical conductivity and mechanical flexibility. When a force is applied on ...

However, trading remained subdued as investors adopted a cautious stance ahead of the Dragon Boat Festival holiday. The ...

The flexibility of the polyimide substrate allows for a minor 1.043% shift in the resonance when the planar metasurface of the toroidal dipole is curved at a 4.53-rad angle, and applying a stretching ...

Cathay Securities Investment Consulting manager Tsai Ming-han (蔡明翰) said the day’s decline is a normal adjustment following ...

The expansion of the edible fungi cultivation scale led to a shortage of cultivation substrate, making the development and utilization of new substrates a research hotspot. Ginger straw, the main ...

Polyimide (PI) is a candidate material that is showing promise ... We then assembled multilayered films by depositing the hollow PI NPs electrophoretically onto a substrate. After spin-coating a ...