News

Portfolio reviewers attend the annual event in search of talented designers and visual communicators with unique creative ...
Intel asserts it is the industry leader in packaging technologies for semiconductors, which today have expanded capabilities ...
8 industry experts reveal their thoughts on a new wave of product/package development in a ‘circular-inspired’ time.
Paradigm Gallery + Studio opens Kelly Kozma's solo exhibition, 'Watch Me Backflip,' focused on repurposing colorful found ...
But they can still find ways to make their packaging greener by taking advantage of the best of modern technology. Consider ...
G networks are even more complex than 4G, making Qorvo's expertise even more valuable to device makers. These trends should make for a nice runway for further RF growth for Qorvo. Meanwhile, Qorvo is ...
Synopsys (SNPS) announced a broad Electronic Design Automation, or EDA, and Intellectual Property collaboration with Intel ...
Meanwhile, Cadence and Intel Foundry are engaging in early design technology co-optimization for Intel 14A-E to establish the readiness of Cadence EDA flows for the next-generation advanced node.
Nexperia is now offering a portfolio of 16 new low forward voltage (VF) optimised planar Schottky diodes in CFP2-HP packaging ...
Bliss Buter-Thompson, Head of Packaging at Logitech, and her team design, develop, and test every single one. The Journey to Logitech After earning a degree in illustration from the Massachusetts ...
Using new, patented glass technology developed by Diageo's design team this lighter, lower-carbon bottle embodies the future of luxury packaging, fusing sustainability with exceptional craftsmanship.