Cerence AI, in collaboration with MediaTek and NVIDIA, has unveiled an advanced multi-modal language model designed for automotive applications, just ahead of Auto Shanghai 2025. This development ...

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management ...

Technology announces the MCPF1412, a highly efficient and fully integrated point-of-load 12A power module with a 16V VIN buck ...

China’s SMIC has reportedly produced 5nm chips without EUV using DUV and SAQP, signaling a bold shift in chipmaking amid ...

"We are committed to fostering strong partnerships with local businesses, educational institutions, and workforce training ...

The DS1050A Embedded Security Testbench from Keysight targets security flaws in modern chips and embedded systems.

Pre-built systems in China are now arriving with Intel's IPO profiles, designed to enhance performance without voiding your ...

Apple in October 2024 overhauled its 14-inch and 16-inch MacBook Pro models, adding M4, M4 Pro, and M4 Max chips, Thunderbolt ...

A new publication from Opto-Electronic Advances; DOI 10.29026/oea.2025.240250, discusses on-chip multi-channel near-far field terahertz vortices with parity breaking and active modulation.

As the US-China trade war intensifies, Chinese memory module manufacturers are ramping up procurement efforts to secure inventory for at least two to three quarters. Industry insiders reveal that ...

TechInsights, a Canadian tech research firm, took apart a Huawei 910B AI accelerator and found a TSMC die, as it's also called, in the multi-chip system. After the TechInsights finding ...