TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

These packages combine multiple logic dies and stacks of HBM3/3E, but apparently that’s no longer enough. TSMC plans to roll out CoWoS-L with 4,719 mm² interposers and 100×100 mm substrates ...

Yesterday, TSMC ... (CoWoS). Resolution is a bit low, but the package is visibly smaller. So, what does TSMC say about its 16nm FinFET? Quite a number of things. According to the foundry, the ...

A recent report citing unnamed industry sources claims that TSMC’s orders for chips to be used in Android smartphones are ramping up, as clients like HiSilicon, MediaTek and Qualcomm are placing ...

TSMC is also in the middle of developing next-generation advanced packaging technologies, including new technologies and processes thrown into the mix, including CoWoS-R, SoW, and more.

TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which in turn is ...

today announced the tapeout of Cadence ® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology. Implemented on TSMC’s 3DFabric™ CoWoS-S silicon interposer technology ...

As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. The world of AI chips hasn't stopped, and won ...