Taiwan Semiconductor Manufacturing Co. reported another record quarter on AI-driven demand for chips and said it expects continued growth even as it navigates the U.S.-China technology rivalry ...

Investors are still concerned about the sustainability of the AI boom amid speculation that Nvidia was scaling back orders for TSMC’s advanced packaging chip-on-wafer-on-substrate (CoWoS) technology ...

Nvidia’s most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip-on-wafer-on-substrate (CoWoS) advanced packaging technology offered ...

CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...

In addition, Taiwan media reported that Nvidia was cutting CoWoS-S orders from TSMC in a potential hit to the Taiwanese chip foundry's revenue. Nvidia has been selling its Blackwell chips as ...

Taipei, Taiwan — Taiwanese chipmaking giant TSMC on Thursday announced a better-than-expected net profit for the fourth quarter as it benefits from booming demand for AI technology. Taiwan ...

CoWoS refers to complex chip–on–wafer–on–substrate, a technology used by Nvidia’s primary partner, Taiwan Semiconductor Manufacturing Co. (TSM), to package chips for the AI giant.

Nvidia's demand for TSM's advanced CoWoS packaging remains strong as it transitions to Blackwell AI chips with new CoWoS-L technology. TSM plans to double CoWoS production by 2025, with Nvidia ...