News

ASE has transitioned to AMD EPYC and Ryzen processors across its data centers and client systems, achieved major performance ...
Alphawave Semi announces successful tape out of UCIe IP subsystem on TSMC's 2-nm process, supporting 36G die-to-die data ...
Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...
Nvidia, the American tech giant behind some of the world’s most powerful graphics and AI chips, is stepping up its hiring ...
First UCIe Die-to-Die IP Subsystem on TSMC's 2nm Process with CoWoS Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects Alphawave ...
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, announced the successful tape out of one of the industry's first ...
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology ...
The media in Taiwan have highlighted the lucrative compensation packages being used to tempt engineers to fill key roles and ...
TSMC's CEO, CC Wei, said demand for AI chips has outpaced supply.
Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.
TSMC's dominance in advanced nodes and AI packaging positions it as an irreplaceable infrastructure in the global ...
CEO C.C. Wei says demand for artificial intelligence (AI) chips remains robust, outpacing supply, despite the uncertainty created by U.S. tariffs. Speaking at TSMCs ...