Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology ...

TSMC's dominance in advanced nodes and AI packaging positions it as an irreplaceable infrastructure in the global ...

First UCIe Die-to-Die IP Subsystem on TSMC's 2nm Process with CoWoS Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects Alphawave ...

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, announced the successful tape out of one of the industry's first ...

The rapid expansion of generative AI has triggered a boom in data center construction and hardware production. As AI ...

The media in Taiwan have highlighted the lucrative compensation packages being used to tempt engineers to fill key roles and ...

Research reveals that AI could consume nearly half of data center electricity by the end of 2025—making Bitcoin's ...

Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.

Nvidia, the American tech giant behind some of the world’s most powerful graphics and AI chips, is stepping up its hiring ...

A co-design flow of packaging and ASIC design allows customers to evaluate and balance the many factors at play. A co-design ...