CoWoS technology started as a risky idea in 2009, created by Chiang Shang-yi. At first, many people thought it was too ...

NVIDIA's next-gen Rubin GPU and Vera CPUs will reportedly tape-out at TSMC in June, sampled in September, on TSMC N3P and ...

CoWoS packaging tech quietly shifts the AI battleground, and there’s a $165 billion U.S. power play behind it.

“This is a global business,” explained Alchip President and CEO Johnny Shen. “We have the corporate goal of doubling our global design capacity. With the opening of our Vietnam centers and the ...

ASE Technology is a market leader in the OSAT industry, leading the pack with 33% market share. Read why I rate ASX stock a ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most ...

Alphawave Semi announces successful tape out of UCIe IP subsystem on TSMC's 2-nm process, supporting 36G die-to-die data ...

Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...

Nvidia, the American tech giant behind some of the world’s most powerful graphics and AI chips, is stepping up its hiring ...

Alphawave Semi has taped out of one of the industry’s first UCIe IP subsystem on TSMC’s N2 process, supporting 36G die-to-die ...

First UCIe Die-to-Die IP Subsystem on TSMC's 2nm Process with CoWoS Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects Alphawave ...

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure, announced the successful tape out of one of the industry's first ...