Consumer packaging dumps 19 million metric tons of plastic waste into the environment each year, according to the nonprofit advocacy group Beyond Plastics. Experts say we can do better.

Intel is promoting this advanced packaging technology as a key building block for high-speed chiplet designs and has partnered with major EDA and IP houses to accelerate implementations around EMIB-T ...

“This facility will serve as a strategic hub for producing bespoke plastic packaging solutions tailored to the unique needs of our clients across diverse industries.” “We are so proud to ...

For as much as the design industry exaggerates the narrative and drama around unboxing a product, Kind is one of the few brands in which the packaging really does serve the customer experience.

the conservative boutique firm is enjoying a period of success. Over the past four years, the 15-person firm has emerged as one of the most visible law firms leading the charge to advance ...

Kennedy Jr. said he's considering major changes in how food packaging is regulated, and he wants more focus on human health risks from microplastics and chemicals used in polymers. While some ...

As sustainability regulations continue to reshape industries around the world, the packaging sector stands at the vanguard of the circular economy transition. Initiatives such as extended producer ...

Researchers at Virginia Tech have found a way to make biodegradable packaging stronger while using less energy in the process. The research team from the College of Agriculture and Life Sciences ...

When 2025 began, packaging experts agreed that the number one trend in their industry this year would be sustainable materials, ranging from biodegradable and compostable packaging to eco-friendly ...

Unlike most semiconductor packaging steps, hybrid bonding occurs much closer to the chip's production line and work together with Applied Materials' tools. "I think shareholders will be extremely ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

Kelly: I agree with that. There are some really good conferences. On the design side there is DesignCon and Hot Chips, and in the packaging world there are ECTC and IMAPS. Those are good sharing ...