Hybrid circuit protection devices, using a combination of technologies, provide better protection for industrial Ethernet ...

Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.

Vishay’s ISOA200 thick-film power resistors with optional NTC thermistor and phase-change thermal interface material saves ...

Littelfuse’s IXD2012NTR high-side and low-side gate driver drives two N-channel MOSFETs or IGBTs in a half-bridge ...

Microchip’s highly integrated MCPF1412 power module saves space and delivers flexible configuration and monitoring.

Bourns’ BVRA1210 and BVRA1812 multilayer varistors with advanced transient energy absorption deliver high surge protection.

Navitas’ SiCPAK power modules claim a 5× lower thermal resistance shift after 1,000 cycles of thermal shock testing.

Green Watt Power’s Diamond Series of 2.4-kW AC chargers target e-mobility applications with 36-120-V Li-ion batteries.

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and space-based systems. Molex has released a new report from AirBorn, a Molex ...