This shift is a major step in how we handle and interact with information ... The company also launched the ‘Federal AI Solution Factory’ in collaboration with Google Public Sector, aimed ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

TSMC to begin equipment move-in at its biggest CoWoS advanced packaging and testing plant, AP8 in the Southern Taiwan Science ...

TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate ...

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

TSMC's first factory in Japan has begun mass production, producing Japan's most advanced semiconductor chips. These chips will be used in image sensors and cars, strengthening Japan's domestic ...

TL;DR: TSMC's first Japanese wafer fab in Kumamoto will begin mass production by late 2024, supplying Sony and Denso with 22nm, 28nm, 12nm, and 16nm chips. A second factory will start by 2027 ...

Taiwan's TSMC, the world's largest foundry (semiconductor manufacturing), began mass production of semiconductors at its Kumamoto plant in Japan this month, as reported by the Nihon Keizai Shimbun ...

TSMC said its first factory in Phoenix was expected to begin commercial production in the first half of 2025. The company has two more factories in the pipeline. The plants will make advanced ...

positions TSMC to maintain its technological leadership. The company's advanced packaging capabilities, particularly in CoWoS technology, are experiencing demand that far outstrips supply ...