Sustainable packaging solutions provider AeroFlexx has entered into a strategic partnership with Chemipack, a Polish blending ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

The packaging industry is undergoing a significant transformation, driven by changing consumer behaviours and evolving market ...

New research suggests that silver nanoparticles can leach out of antimicrobial plastic packaging and contaminate solid foods.

"CUH and IIP collaborate on packaging science research" was originally created and published by Packaging Gateway, a ...

Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...

From innovative materials to stricter regulations and shifting consumer expectations, businesses must adapt to remain ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

The Department of Science and Technology-Davao Region is driving innovation in sustainability through advancements in green ...

AeroFlexx, a leader in sustainable packaging, has launched a partnership with blending and filling company, Chemipack Sp. z o.o., headquartered ...

Nineteen partners from six different countries have committed to participating. Plastics technology company unveils project ...