Strong demand for artificial intelligence chips has delivered a stellar quarter for Taiwan Semiconductor Manufacturing Co., or TSMC. The company said Thursday that revenue for the December quarter ...

CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...

In addition, Taiwan media reported that Nvidia was cutting CoWoS-S orders from TSMC in a potential hit to the Taiwanese chip foundry's revenue. Nvidia has been selling its Blackwell chips as ...

Taipei, Taiwan — Taiwanese chipmaking giant TSMC on Thursday announced a better-than-expected net profit for the fourth quarter as it benefits from booming demand for AI technology. Taiwan ...

CoWoS refers to complex chip–on–wafer–on–substrate, a technology used by Nvidia’s primary partner, Taiwan Semiconductor Manufacturing Co. (TSM), to package chips for the AI giant.

Nvidia's demand for TSM's advanced CoWoS packaging remains strong as it transitions to Blackwell AI chips with new CoWoS-L technology. TSM plans to double CoWoS production by 2025, with Nvidia ...

TSMC, the world's largest contract semiconductor manufacturer, reported Thursday that its net income increased 57% year-over-year to NT$374.68 billion, or $11.6 billion. Revenue between October ...

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on substrate (CoWoS) advanced packaging technology provided by TSMC. Huang ...