with NVIDIA Chief Scientist Bill Dally saying at TSMC's recent North American Technology Symposium that the B200 AI chip uses CoWoS advanced packaging to package two GPUs, breaking the limitations ...

These packages combine multiple logic dies and stacks of HBM3/3E, but apparently that’s no longer enough. TSMC plans to roll out CoWoS-L with 4,719 mm² interposers and 100×100 mm substrates ...

TSMC speeds up AI chip packaging expansion despite Nvidia's order cuts, targets future growth through collaboration with Intel Global CoWoS and CoWoS-like packaging capacity demand to surge 113% ...

The big picture: The semiconductor industry is approaching a significant milestone as TSMC ... into the CoWoS-L substrate, allowing power to be routed efficiently through the package.

supports 3Dblox and enables TSMC's CoWoS ® technology with 5.5x-reticle interposer sizes. In addition, Synopsys provides complete, silicon-proven IP solutions on TSMC's advanced processes ...

Mass production is set for 2027. TSMC’s strength in manufacturing was reinforced by rapid scaling in CoWoS and SoIC capacity, both growing at over 80% CAGR through 2026, while its silicon ...

The foundry giant announced that by 2027, it aims to mass-produce 9.5 reticle size CoWoS, enabling packages with 12 or more HBM stacks alongside cutting-edge logic technology. Following the ...

Despite weaker smartphone sales and mounting geopolitical risks, TSMC remains unfazed. Chairman and CEO C.C. Wei reaffirmed the chipmaker's strong 2025 outlook during its latest earnings call ...

The U.S. President, Donald Trump, believes that TSMC is a trustworthy company and has no choice but to invest $100 billion in the U.S. These comments come amid reports that the chip manufacturer ...

Digital and analog design flows on TSMC A16™ and N2P deliver optimized performance and rapid analog design migration, enabled by Synopsys.ai Early collaboration on TSMC A14 process underway for ...

TSMC's AI-driven growth and technological advancements, including the upcoming N2 and 1.4nm processes, position it as a leader in the semiconductor industry. Despite short-term economic ...

supports 3Dblox and enables TSMC's CoWoS ® technology with 5.5x-reticle interposer sizes. In addition, Synopsys provides complete, silicon-proven IP solutions on TSMC's advanced processes, enabling ...