In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most powerful company” according to US President Donald Trump, unveiled a $100 ...

The rapid expansion of generative AI has triggered a boom in data center construction and hardware production. As AI ...

NVIDIA is planning to ship a cut-down version of its RTX Pro 6000 server-class graphics card with key specification ...

TSMC performs CoWoS packaging, integrating the GPU die ... TSMC’s CoWoS capacity and air cargo lanes were saturated with H100 data center shipments. Overall, AMD follows a hybrid approach: it ...

Faruqui says NVIDIA’s H100 and Blackwell GPUs ... makes this highly complex packaging possible by using packaging architectures such as CoWoS-S (chip on wafer on substrate–silicon interposer) or CoWoS ...

A cross-industry workstream was established by the Pharmaceutical Manufacturing Forum to identify the technical and regulatory challenges for accelerating the transition to alternate blister packaging ...

will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...

CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...

Nvidia's demand for TSM's advanced CoWoS packaging remains strong as it transitions to Blackwell AI chips with new CoWoS-L technology. TSM plans to double CoWoS production by 2025, with Nvidia ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity ... system-in-packages like H100, H200, and the alleged B200A.