It’s already mainstream with the H100 from Nvidia and the MI300X from AMD, and the dominant packaging IP is held by TSMC. In fact, the CoWoS technology of TSMC is the new standard for AI ...

Shares of Nvidia (NASDAQ: NVDA) tumbled after the company revealed that it will incur a $5.5 billion charge in the first ...

A dumbed-down version of its H100 and H200 GPUs ... more of Taiwan Semiconductor's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging capacity, which would make it more difficult and time ...

CoWoS-L advanced packaging (full post) Huawei is working on its next-gen Ascend 910D AI GPU, which is said to offer AI performance matching NVIDIA's previous-gen Hopper H100 AI GPU for the Chinese ...

Faruqui says NVIDIA’s H100 and Blackwell GPUs ... makes this highly complex packaging possible by using packaging architectures such as CoWoS-S (chip on wafer on substrate–silicon interposer) or CoWoS ...

NVIDIA's new B300 AI chip production has reportedly been pulled forward to May: will use TSMC 5nm process (N4P) and CoWoS-L ...

Chip packaging just got absurdly massive TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an ...

TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the ...