Fabless manufacturer AIchip Technologies is going all in on CoWoS advanced packaging technology, having recently elected a ...

Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...

Alphawave Semi announces successful tape out of UCIe IP subsystem on TSMC's 2-nm process, supporting 36G die-to-die data ...

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology ...

The rapid expansion of generative AI has triggered a boom in data center construction and hardware production. As AI ...

A co-design flow of packaging and ASIC design allows customers to evaluate and balance the many factors at play. A co-design ...

First UCIe Die-to-Die IP Subsystem on TSMC's 2nm Process with CoWoS Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects Alphawave ...

ASE has transitioned to AMD EPYC and Ryzen processors across its data centers and client systems, achieved major performance ...

Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to TSMC and Samsung, plans to cut PIMEL shipments.

TSMC's dominance in advanced nodes and AI packaging positions it as an irreplaceable infrastructure in the global ...

NVIDIA plans a cheaper AI chip for China with limited specs to meet U.S. export rules and compete with Huawei.