TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market ...

TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an obscene amount of silicon into a single unit. According to Tom’s Hardware, the outfit is working on a 9.5 ...

will transition from CowoS-S to CoWoS-L advanced packaging technology. That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect ...

You might often think of processors as being relatively small, but TSMC is developing a version of its CoWoS technology that will enable its partners to build multi ...

Originally, the industry rumor mill expected TSMC's CoWoS capacity expansion to start leveling off by 2026. Early projections had the company's monthly packaging volume topping out around 100,000 ...

TL;DR: TSMC is considering building new CoWoS advanced packaging plants in the US and Japan due to strong demand, particularly for AI chips from NVIDIA. The company plans to double its production ...

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It will also produce a version using its Chip-on-Wafer-on-Substrate (CoWoS) technology by 2027, allowing for a monumental increase in performance-per-watt and overall compute power. TSMC says this ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...

The Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly increased its orders for machines needed for Chip on Wafer on Substrate (CoWoS) packaging by 30% to keep up with the rising ...

With that, TSMC is growing its leadership within foundry, and adding to the much needed CoWoS capacity that is current in short of supply. TSMC stated that for its N2 fabrication process ...

TSMC's Advanced Backend Fab 7 will cost TSMC several billions of dollars and will be equipped to support advanced backend packaging technologies like InFO CoWoS. TSMC's CoWoS-S is used for AMD's ...