Izmo shares jump 5% as arm develops 3D SiP module for space electronics

By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...
Electronic Design

Packaging: DRAM Stacking Technology Enables High-Density Modules

Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...
Semiconductor Engineering

When Less Can Be More With Smart Module Design: Part 1

Size and power often seem like opposite sides of a coin. When you reduce size – one of the ever-pressing goals in our industry – you inevitably reduce power. But does that have to be the case? By ...
pv magazine International

New stack design for cheaper redox flow batteries

A group of scientists from the German research institute Fraunhofer Umsicht claims to have reduced the production costs of redox flow batteries by redesigning one of its main components – the stack.
Electronic Design

Managing Stack Size for Automotive Embedded Systems

Today’s sophisticated vehicles leverage embedded systems for everything from infotainment to powertrain management. Even low-end automobiles incorporate scores of electronic control units (ECUs). By ...