Samsung says it made structural changes to internal components such as the printed circuit board and thermal systems to achieve the thinner design without sacrificing performance. The device runs ...

TL;DR: A leak reveals NVIDIA's GeForce RTX 5090 PCB featuring the GB202 GPU and Samsung's 28Gbps GDDR7 ... looks insanely powerful with its array of components, but now we've got a closer look ...

Samsung has now introduced the Galaxy S25 Edge, an ultra-thin iteration of its flagship smartphone series. The device will be ...

SEOUL, South Korea — Samsung Electronics made public on Tuesday ... the thickness of internal components, including the printed circuit board and thermal systems. Analysts said the launch ...

SEOUL >> Samsung Electronics made public on Tuesday its slimmest flagship model to date, complete with enhanced artificial intelligence features, as it seeks to get ahead of rival Apple in the premium ...

Samsung Electronics, the world leader in advanced memory technology ... By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as ...

Samsung Electronics made public on Tuesday its slimmest flagship model to date, complete with enhanced artificial intelligence features, as it seeks to get ahead of rival Apple on the premium market.

Samsung kicked off large-scale runs of its HBM3E 12Hi stacks in early 2025, with the first wafers landing in February. Each stack packs twelve memory layers for a cool 36 GB of capacity.

iFixit performed a teardown of the Samsung Galaxy Ring and the conclusion ... coil on the Galaxy Ring is not soldered to the printed circuit board (PCB) like on other smart rings and instead ...

SEOUL (Reuters) - Samsung Electronics made public on Tuesday ... the thickness of internal components, including the printed circuit board and thermal systems. Analysts said the launch was ...