The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and HPC workloads better than we have been able to do thus far. But, as we were ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

At CES 2026, sleek new laptops dazzled—but soaring memory costs driven by AI chip demand threaten to make everyday PCs ...

Future AI memory chips could demand more power than entire industrial zones combined 6TB of memory in one GPU sounds amazing until you see the power draw HBM8 stacks are impressive in theory, but ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

Memory startup d-Matrix is claiming its 3D stacked memory will be up to 10x faster and run at up to 10x greater speeds than HBM. d-Matrix's 3D digital in-memory compute (3DIMC) technology is the ...

Samsung's new codename Shinebolt HBM3e memory features 12-Hi 36GB HBM3e stacks with 12 x 24Gb memory devices placed on a logic die featuring a 1024-bit memory interface. Samsung's new 36GB HBM3e ...