Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

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Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

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TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...