Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

Washington is officially the seventh U.S. state to adopt packaging EPR. By 2032, it will require companies using plastics and ...

In 2023, the Fan-out Wafer Level Packaging (FOWLP) segment led the Interposer and Fan-out Wafer Level Packaging Market, representing around 67% of total revenue. Its popularity stems from superior ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic ...