According to the Flexible Packaging Association, this segment already makes up around 21% of the U.S. packaging market. For ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the ...

Shannon Blue of SGK explains how brands can use QR codes and smart packaging to drive consumer interaction, loyalty, and ...

As connected packaging evolves into mainstream CPG products, the technology can be used to expand on a brand’s sustainability ...

Retailers mentioned as using the receipt paper include Burger King, Claire’s, The Cheesecake Factory, Forever 21, GAP and Subway.

In 2023, the Fan-out Wafer Level Packaging (FOWLP) segment led the Interposer and Fan-out Wafer Level Packaging Market, representing around 67% of total revenue. Its popularity stems from superior ...