As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity ... system-in-packages like H100, H200, and the alleged B200A.