Chip packaging just got absurdly massive TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an ...

This shift comes as HBM and chip-on-wafer-on-substrate (CoWoS) technology growth has begun to slow amid issues related to overheating, power consumption, and cost challenges taking hold.

This test chip was implemented using TSMC's cutting-edge N3P process technology and CoWoS-R advanced packaging ... In line with previous GUC HBM, GLink, and UCIe IPs, this HBM4 IP integrates ...