This ball-bonder type wire-bonding machine makes ... However, controlling the wire-bonding process is tricky — requiring high accelerations, short move and settle times, high accuracy, and ...

--(BUSINESS WIRE)--Palomar Technologies, provider of precision automation equipment and process development ... Model 8000 ball bonder to maximize the bonding speed, reliability, and reduced ...

While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's National ...