Package-on-package (PoP) assembly is a quickly evolving 3D packaging trend (or, to be more politically correct, "technique") that meets today's demand for lighter, faster and miniaturized electronics, ...

SAN DIEGO--(BUSINESS WIRE)--Elenion Technologies (“Elenion”), a leading designer and provider of silicon photonics-based System-on-Chip solutions, today announced its next- generation Coherent Silicon ...

During electrical design process, certain design choices need to be made. One example is USB C type connector-based design with a straddle-mount connector. In such scenario, the overall PCB thickness ...

With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the ...

Intel’s BGA processors are definitely going to become a bigger part of Intel’s portfolio in the future and by the looks of things these BGA packages are mainly designed to transform the bottom segment ...

Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

Eagan, MN. Ironwood Electronics has introduced a new BGA socket design using a high-performance elastomer contactor. The socket offers low inductance and high endurance, and it can serve ...

Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe SSD solutions in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebooks, according to the South ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The LTM8046 from Linear Technology Corp. is a 2.5 W output dc-to-dc µModule® (micromodule) converter with 2 kVac galvanic isolation (production tested to 3 kVdc) in a 9 x 15 x 4.92 mm ball grid array ...