The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...

Designed for 1.0-mm-pitch BGA chips, such as the Renesas 256 PBGA and Cypress 256 FBGA, the SS-BGA256E-01 BGA socket operate at bandwidths up to 10 GHz with less than 1 dB insertion loss. Heat ...

The SG-BGA-7064 chip socket accommodates 0.75-mm-pitch ICs with 7.286 x 10.85-mm-footprints. The devices operate in excess in 10 GHz and support dense 48-ball BGA stacked devices using ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Greenliant has recently announced the release of its NVMe NANDrive BGA SSDs, a new line of solid-state drives designed to endure the harshest environments while delivering exceptional performance.

The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, ...

Upgrading RAM on most computers is often quite a straightforward task: look up the supported modules, purchase them, push a couple of levers, remove the old, and install the new. However, this project ...

A trio of high-speed SigmaRAM SRAMs are being made using a 0.13-µm CMOS process that have a capacity of 18 Mb and low power consumption. The three SRAMs are known as: Double Late Write and Pipelined ...

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...